HIFU technology is the new non-invasive body contouring system, combined with advanced contact cooling technology, which reduces the pain in the epidermal and nerve area, making it possible to have higher energy delivery to the treatment areas.

Thermal energy is generated using HIFU technology. With this thermal energy, fat cells are destroyed to reduce the circumference of the waist.

Procedures using HIFU technology use the high temperature of 65-100℃, generated when applying the high-intensity ultrasound energy on one spot, to burn the target tissue, without damaging the upper layer of the skin. Along with burning the fat, it helps in tightening the tissue, giving a more toned body.

Areas that can be treated are thighs, abdomen, arms, love handles, polymastia (fat on upper back) and gynecomastia (fat near underarms).

Note: One can undergo this treatment only after 1 year of childbirth.

Reshaping disproportionate curves or reducing unwanted fat cannot always be achieved through weight loss and exercise alone. Fitness and skin care have little effect on uneven contours or bulges as well as skin that lacks elasticity. Body contouring can help many people reshape body features that cannot be improved by other measures. Body contouring can dramatically improve the shape and proportion of your body, enhancing your appearance and boosting your self-confidence.

Laser Lipolysis can be done on all the body parts like face lifting, double chin, arms, upper back, lower back, abdomen, love handles, thighs, buttocks. It is also known for instant improvement in naso-labial folds, crow’s feet and fine lines on face and neck. It is great for a quick face lift before a party or even toning the body before you fit into a skinny dress for your special day.

Treatment is generally considered by most people to be painless. You are able to return to your normal activities straight afterwards. The result is immediate Skin tightening/ inch loss of any part of the body, however around 6-8 sittings are required for permanent results.